Message from the CEO

To our customers and business partners,

With the summer coming to an end, I hope you can look back at great times spent with family and friends, experiences that offered new perspectives, plain awe or humble appreciation, and above all the ability to recharge. This is also the time of the year when we regularly experience a reenergization of the manufacturing industry. As you get ready to tackle open or new automation projects, I’d like to share some noteworthy developments at Pearson Packaging Systems with you.

• • Eight-Week Lead Times are back! Even though this fast-track delivery option is specifically designed for our high-demand, pre-engineered solutions such as the CE25 Case Erector and Sealer, for me the reintroduction of this option officially marks Pearson’s full return to best-in-class lead times. As you navigate how to deliver automation-related efficiency gains faster to your organization and free up cashflow tied up in lengthy down payments, Pearson continues to make short leads a top priority of our business strategy. Before the pandemic, you were able to receive select equipment models in 4-6 weeks, which is what you can expect from us again in the near future.

• • Our portfolio is expanding with the introduction of the new CE15 Case Erector. The highly anticipated reengineered low-speed box former offers an aggressive price point, time-tested performance features such as the dual-opposed vacuum opening and user-centric HMI, as well as a comprehensive guard package optimized for easy access to the machine. Initial customer feedback has been exceptionally favorable, which led to our decision to prepare offering fast-track delivery on this product as well.

• • In addition to the machine launch, we are also answering the continuously intensifying call for intuitive machine interfaces by actively transitioning our HMIs to Rockwell’s new FactoryTalk Optix platform. Offering a PC-like user experience, responsive graphics and data visualization tools, scalable diagnostics, and alarms as well as IIoT connectivity, this platform enables us to advance our HMI far more efficiently with greater impact to your operators at a much faster pace. After reaching the limits of the previous platform’s capabilities, we are excited to build on the foundation of our User-Centric Design and explore each new platform feature as we strive to close the gap towards a fully intuitive user experience that removes all barriers and need for operator training or manuals.

• • Lastly, after the successful introduction of our line of high-performance hot melt adhesives to accompany our equipment, we have now expanded our consumables portfolio to include tape as well. Under the trademark PearsonTape^TM, the comprehensive portfolio of hot melt and adhesive tapes offers you another OEM verified option to optimize your consumable spend while meeting or exceeding the performance requirements of your case sealing applications.

If you would like to learn more about the recent developments at Pearson, I encourage you to reach out to us. We look forward to partnering with you in optimizing your secondary packaging processes.

Before I close my message, I would like to take the opportunity to ask for your help in determining where we need to focus our priorities to continue earning your business or become a new partner of yours. To effectively collect and analyze your responses and develop actionable improvement plans, we are utilizing a survey format with 14 questions. We are very appreciative if you have the ability to share 5-10 minutes of your time with us!

–> Follow this Link to the Survey

Sincerely,

Michael Senske
President and CEO
Pearson Packaging Systems